AMD "Gorgon Halo" Ryzen AI Max 400 Series: Key Details from Recent Leak

A significant leak has revealed new information about AMD's upcoming refresh of its "Strix Halo" silicon, now reportedly codenamed "Gorgon Halo." According to sources cited by VideoCardz, this new family of mobile processors is set to succeed the current Ryzen AI Max+ 395 lineup, with the flagship model expected to be the Ryzen AI Max+ 495.

Shortly after the initial leak, Hong Kong-based publication HKEPC published further details, listing five distinct models within the Ryzen AI Max 400 series. These processors are said to leverage AMD's latest architectures: Zen 5 for CPU cores, RDNA 3.5 for integrated Radeon graphics (either 8060S or 8050S), and XDNA 2 for the neural processing unit (NPU).

Architectural Enhancements and Performance Expectations

The "Gorgon Halo" APUs are described as a "half-generation upgrade" over the existing Strix Halo lineup. HKEPC reports that these new models will benefit from improved chip quality, allowing for higher clock speeds while maintaining the same thermal design power (TDP) as their predecessors. This enhancement is expected to deliver notable gains in multicore performance, making the new Ryzen AI Max 400 series particularly appealing for demanding mobile computing tasks.

An engineering sample, identified by the serial code "100-000002127," appears to correspond to the entry-level Ryzen AI Max 485. The leak suggests that the entire lineup will launch around October, positioning AMD to compete strongly in the high-performance mobile processor market.

Leaked Specifications: AMD Ryzen AI Max 400 Series

According to HKEPC, the following five models are expected in the Ryzen AI Max 400 series:

  • Ryzen AI Max 485 (OPN: 100-000002127) – 55W TDP
    CPU: 8 cores / 16 threads (3.6 GHz base, 5.0 GHz boost)
    GPU: Radeon 8050S (2.8 GHz)
  • Ryzen AI Max+ 488 (OPN: 100-000002140) – 55W TDP
    CPU: 8 cores / 16 threads (3.6 GHz base, 5.0 GHz boost)
    GPU: Radeon 8060S (2.9 GHz)
  • Ryzen AI Max 490 (OPN: 100-000002142) – 55W TDP
    CPU: 12 cores / 24 threads (3.2 GHz base, 5.0 GHz boost)
    GPU: Radeon 8050S (2.8 GHz)
  • Ryzen AI Max+ 492 (OPN: 100-000002143) – 55W TDP
    CPU: 12 cores / 24 threads (3.2 GHz base, 5.0 GHz boost)
    GPU: Radeon 8060S (2.9 GHz)
  • Ryzen AI Max+ 495 (OPN: 100-000002145) – 55W TDP
    CPU: 16 cores / 32 threads (3.1 GHz base, 5.2 GHz boost)
    GPU: Radeon 8060S (3.0 GHz)

All models are expected to feature a 55W TDP, with the top-tier Ryzen AI Max+ 495 offering up to 16 CPU cores and 32 threads, paired with a high-performance integrated Radeon GPU.

Outlook for AMD's Next-Gen Mobile Processors

The leaked details suggest that AMD is preparing a robust refresh of its mobile APU lineup, focusing on improved performance through architectural enhancements and higher clock speeds. With the anticipated launch later this year, the Ryzen AI Max 400 series could set a new standard for high-end mobile computing, particularly in AI-accelerated workloads and graphics-intensive applications.