News & Articles

(PR) EK introduces the EK-Pro GPU Water Block designed for the NVIDIA RTX 4090 WindForce V2.
(PR) EK introduces the EK-Pro GPU Water Block designed for the NVIDIA RTX 4090 WindForce V2.
EK introduces the EK-Pro GPU WB RTX 4090 WindForce V2 - Nickel + Inox, a high-performance water block designed for the NVIDIA GeForce RTX 4090 graphics card, featuring a durable nickel-plated copper base and precision laser-cut stainless-steel top for superior cooling efficiency.
TSMC reveals new HBM4 base dies, constructed using 12 nm and 5 nm technology nodes.
TSMC reveals new HBM4 base dies, constructed using 12 nm and 5 nm technology nodes.
TSMC's announcement at the European Technology Symposium 2024 reveals plans to manufacture next-generation HBM4 base dies using 12 nm and 5 nm nodes, promising improved performance, power consumption, and logic density for high-performance computing and artificial intelligence applications.
ASUS introduces the Radeon RX 7900 XTX and RX 7900 XT DUAL OC graphics cards.
ASUS introduces the Radeon RX 7900 XTX and RX 7900 XT DUAL OC graphics cards.
ASUS expands its RX 7900 series with the introduction of the Radeon RX 7900 XTX and RX 7900 XT DUAL OC graphics cards, featuring a common board design with a large cooler shroud, triple-slot board design, and a cooling solution using an aluminium fin-stack heatsink with two Axial-Tech fans.
Palit introduces the GeForce RTX 4070 and RTX 4060 Ti White Series.
Palit introduces the GeForce RTX 4070 and RTX 4060 Ti White Series.
Palit Microsystems Ltd introduces the White Series for the GeForce RTX 4070 and RTX 4060 Ti graphics cards, offering a sleek white design, optimized thermal performance, and exceptional processing power for gamers and creators alike.
AOC Announces the 24G4XE and 27G4XE Gaming Monitors under the AGON brand.
AOC Announces the 24G4XE and 27G4XE Gaming Monitors under the AGON brand.
AGON by AOC introduces the latest additions to its G4 series, the 24G4XE and 27G4XE models, offering high performance specifications at a more accessible price point for core gamers seeking competitive-level gaming experiences.
AMD introduces the Ryzen 7 8700F ($270) and Ryzen 5 8400F ($170) to the market.
AMD introduces the Ryzen 7 8700F ($270) and Ryzen 5 8400F ($170) to the market.
AMD has officially released the Ryzen 7 8700F and Ryzen 5 8400F processors, featuring disabled integrated graphics but impressive AI capabilities and competitive performance compared to Intel counterparts, all at attractive price points.
The Dell XPS Roadmap Leak reveals details about multiple upcoming Intel, AMD, and Qualcomm processors.
The Dell XPS Roadmap Leak reveals details about multiple upcoming Intel, AMD, and Qualcomm processors.
Dell's leaked product roadmap reveals Intel, AMD, and Qualcomm's processor launch dates up to 2027, including the debut of Intel's Core Ultra 400 series in October 2026 and Qualcomm's Snapdragon X V3 in October 2027.
ASUS Republic of Gamers reveals the ROG Tessen Mobile Controller.
ASUS Republic of Gamers reveals the ROG Tessen Mobile Controller.
ASUS ROG introduces the ROG Tessen Mobile Controller, a foldable controller with console-grade controls, programmable rear paddles, and unique design recognized with top awards, offering gamers ultimate portability and superb control on the go.
MSI showcases AI platforms designed for faster processing of compute-intensive applications at ISC 2024.
MSI showcases AI platforms designed for faster processing of compute-intensive applications at ISC 2024.
MSI showcases its latest server platforms at ISC 2024, including the high-performance G4201 supercomputer and the AI training-focused G4101, alongside the cost-effective liquid-cooled S1102-02 server, catering to the diverse needs of HPC and AI markets.
During the IEEE IMW 2024 in Seoul, NEO Semiconductor unveils a floating body cell mechanism that enhances the performance of 3D X-DRAM.
During the IEEE IMW 2024 in Seoul, NEO Semiconductor unveils a floating body cell mechanism that enhances the performance of 3D X-DRAM.
NEO Semiconductor introduces groundbreaking Back-gate Channel-depth Modulation mechanism for Floating Body Cell in 3D X-DRAM, promising significant improvements in data retention and sensing window during the 16th IEEE International Memory Workshop (IMW) 2024 in Seoul, Republic of Korea.